4500 Series Ball Bonders
The precision and reliability of K&S products, experience & support
For process development, production, research or added manufacturing support,
K&S 4500 Series Manual Ball Bonding Systems provide the high yields and excellent
repeatability needed for every gold ball bonding applications, including:
- Optoelectronic Modules
- Hybrid/MCMs
- Microwave Products
- Discrete Devices/Lasers
- Chip-on-Board
Semi-automatic and manual operation modes, individual bond parameter control,
and capacity for a wide range of wire diameters enable ease of use in ball bonding,
ball bumping, coining, security bonding and single-point TAB applications.
| FUNCTION COMPARISON |
Model 4522
(Analog) |
Model 4524AD
(Digital) |
| Modes of Operation |
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| Full Manual Mode (Manual Z Control & Manual X-Y Positioning) |
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| Semi-automatic Z Mode (Semi-automatic Z control and Manual X-Y) |
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| Semi-automatic Z and Auto-Stepback Mode |
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| Auto Second Bond Mode (including Stepback) |
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Multi-Process Capability *
Ball Bonding, Bumping, Coining, Security Bonding, TAB
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Motorized Y Axis and Auto-Stepback
for controlled, highly repeatable wire length and loop formation
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