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The Power Series for K&S
a new generation of semiconductor assembly equipment for today's
most challenging applications. In continution of our tradition of innovation and
technology leadership; Power Series products set new standards for performance,
productivity, reliability,and ease of use Driven by
the most powerful X-Y-Z motion control system available on the market, Power Series products deliver
the highest levels of speed, accuracy, and throughput for reduced cost of ownership Power Series form K&S
the most Powerful name in assembly equipment. |
As its name implies, the IConnPS High Performance Wire Bonde,represents the state-of-the-art in IC inter-Conn-ect
performance for the advanced packaging requirements of both today and tomorrow.
Features
- Extra large 56mm x 80mm bond area
- +/- 2.0 um accuracy
- High Performance X-Y-Z motion control system
- Dual-frequency transducer allows two selectable frequencies for each bond
- Power Series Low Loop allowing forward loops under 50 um in height
- On-board process optimization tools
- Auto-bITS seif-teach and optimization
- WAVI(Wide angle Vertical lllumination)system with programmable red and blue lightion
- Optional programmable optics with a full 2.5mm focus range
- Optonal copper wire bonding kit
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