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The Power Series for K&S
a new generation of semiconductor assembly equipment for today's
most challenging applications. In continution of our tradition of innovation and
technology leadership; Power Series products set new standards for performance,
productivity, reliability,and ease of use Driven by
the most powerful X-Y-Z motion control system available on the market, Power Series products deliver
the highest levels of speed, accuracy, and throughput for reduced cost of ownership Power Series form K&S
the most Powerful name in assembly equipment. |
The ConnXPS High Speed Wire Bonder establishes new benchmarks for net productivity in low
pin count, LED, discrete, and Cost Performance markets..
Features
- Extra large 56mm x 80mm bond area
- +/- 3.0 um accuracy
- High Speed X-Y-Z Motion control system
- Programmable look-ahead vision algorithms for parallel bonding and vision functins
- Dual-frequency transducer allows two selectable frequencies for each bond
- Automatic recovery paths for common production stoppages
- Auto-bITS self-teach and optimization
- WAVI(Wide Angle Vertical lllumination) system with programmable red and blue lighting
- Single magnification optics at 2X
- Optional copper wire bonding kit
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